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Capabilities

PCB Capabilities 2023 Edition

Classifications

Items

General

Material Type

TG130-200 FR-4 Material

S1141/S1000-2/KB-6160/KB-6167F/IT-180A/IT-158/370HR/FR408/TU-768

Halogen Free Material

S1155(TG150)/S1165(TG170)

Panasonic Megtron Series

R5725(Meg4)/R5775(Meg6)

Hydrocarbon Ceramic HF Material

Rogers 4350/Rogers 4003(Lopro)/Arlon 25FR/Arlon 25N

PTFE Material

Rogers Series/Arlon Series/Nelco Series/RT5880

Polyimide Material

N85/P95/P96/VT-901/SF305/RF-775/Dupont AP

Prepreg

7628/1080/2116/IT-180A 1037(LDPP)/IT-180A 1086(LDPP)

HDI RCC

S6018

Hybrid PCB

FR4+PTFE/FR-4+Rogers/FR-4+Aluminum

Design Type

Rigid PCB

Prototyping: 1-40 Layers Mass: 1-30 Layers

Flex/Rigid-Flex

Flex: 1-6 Layers Rigid-Flex:2-14 Layers

Thermal Clad

1-4 Layers with Aluminum/Copper Base

HDI

1+N+1/1+1+1+N+1+1/2+N+2(Laser Drill Blind Via)

High Frenquency PCB

1-10 Layers with Hybrid Build

Polyimide PCB

1-10 Layers with Super High TD 390℃

Surface Finish

HASL(Lead Free)

Tin Thickness:2-35um

OSP

0.2-0.3um

Immersion Gold / ENIG

Nickel: 120-160u" Au:1-10u"

Immersion Silver

Silver: 0.1-0.3um

Immersion Tin

Tin>1.0um

Hard Gold Finger

Au: 50u"

Hard Gold Plated Whole PCB

Au: 50u"

ENEPIG

Soldering: Au:0.03-0.05um Ni:3-5um Pd: 0.05-0.1um

Bonding: Au:0.07-0.15um Ni:3-5um Pd: 0.1-0.15um

Carbon Ink

0.1-0.35mm

Peelable mask

0.2-0.5mm

Soldermask

10-18um

Copper

Copper thickness

Up to 30oz for inner and outer layer

Track/Gap Limit

Finished copper 0.5 OZ

3/3mil

Finished copper 1 OZ

4/4mil

Finished copper 1.5 OZ

6/6mil

Finished copper 2 OZ

8/8mil

Finished copper 3 OZ

11/11mil

Finished copper 4 OZ

13/13mil

Tolerance

Board Thickness Tolerance

Thickness<1.0mm:+/-0.1mm; Thickness>1.0mm+/-10%

Hole Diameter

PTH:± 3mil NPTH:± 2mil Press Fit PTH ±2mil

Hole Location

± 3mil

Etch

± 10% Best

Slot Dimension

± 0.13mm(Min Slot Width 0.6mm)

Outline

± 0.13mm

Countersink/Counterbore Depth

± 0.15mm

Impedance control tolerance

± 5% Best

Drill Hole

Min. Hole Size

0.15mm(<0.15mm Laser Drilling)

0.15mm(<0.15mm Laser Drilling)

PTFE Hole

Min. hole 0.25mm

Aspect Ratio

12:1

Soldermask

Soldermask Brand

Taiyo/Kuangshun/Guangxin

Soldermask Color

Green/White/Black/Yellow/Red/Blue/Purple/Matte Green/Matt Black

Soldermask Plugging

≤0.50mm via hole size

Peelable Mask

Available, SD2954 or SD2955

Min. Soldermask Bridge Width

6mil

Silkscreen

SilkscreenBrand

Taiyo/Kuangshun/Guangxin

SilkscreenColor

White/Black/Yellow/Red/Grey

Others

Back Drilling

Hole Size: 0.5-6.5mm Depth Control ±0.1mm

BuriedVia

Available, min. 0.15mm

Blind Via

Available, min. 0.075mm

Via In Pad

Available

Castellated holes

Available, min. 0.5mm

Edge plating

Available

V-score / jump V-score

30°/45°/60°

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Flex PCB Capabilities

Item

Specifications

Layer count

1-6 layers

Material

Polymide(Kapton) / Polyester(PET)

Base material thickness

12.5, 25, 50um

Base copper thickness

18, 35um

Board thickness tolerance

±0.003mm

Finished copper thickness

18-70um

Dielectric constant

3.4/3

Outline tolerance

±0.1mm

Min trace width/space

3/3mil

Min hole size

0.2mm

Min finished size

10*10mm

Max finished size

250*500mm

Surface treatment

HAL, lead-free HAL, OSP, Immesion gold (ENIG), Immesion Tin

Stiffener

Polyimide, FR4, etc.

Flammability

UL 94 V-O

Stencil/Foil Capabities

Type

Laser-cut

Electro polished

Application

solder

adhesive

Max size

600*500mm

Frame height & width

Determined by customer

Steel thickness

0.10-0.50mm

Bolt hole

Available

Fiducial

Available

Revese Engineering Capabilities

Item

Capabilities

Tolerance

Layer count

1-22 layers

-

Max board thickness

6 mm

±2mil

Max dimension

640×480

±4mil

Min trace width/space

3mil

±0.4mil

Min mechnical hole

0.2mm

±0.01mm

Min buried hole

0.15mm

±0.01mm

Min blind hole

0.1mm

±0.01mm

Copper thickness

-

±1.7um

Stackup/Dielectric analysis

-

±5um

Impedance calculation

5-150Ω

±0.5Ω

Accepts Both Small Volume Production And Mass Volume Production For PCB And PCB Assembly.

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